Materials synthesis and treatment; Spectroscopy methods and lasers

Manufacturer and Model

Suss Microtec - MA/BA6 Gen4


Technical data:

  • 350 W exposure lamp, Hg
  • Alignment mode: Top side
  • Substrate thickness up to 6 mm
  • Exposure modes: Proximity, soft contact, hard contact, vacuum contact


  • 1" square chuck for pieces at least 10x10 mm up to substrates 1"x1"
  • 2x2" square
  • 4" (100 mm) wafer

Mask holders:

  • 2 inch for 
  • 3 inch, possible to use proximity flags
  • 5 inch, possibility to use proximity flags


  • i-line filter
  • ND33 filter


  • 5x
  • 7.5 offset

Applications and capabilities

Mask aligner is designed to accurately align masks with substrates enabling photlitography.