42nd International Scientific Conference of ISSP UL
From February 23 to 27, 2026, the Institute of Solid State Physics, University of Latvia (ISSP UL) will organize the 42nd ISSP UL International Scientific Conference, held within the framework of the 84th Scientific Conference of the University of Latvia. Each year, the ISSP UL conference brings together researchers, students, and collaboration partners to share the latest research results, scientific achievements, and the Institute’s future plans.
The conference serves as an open platform where ISSP UL researchers present their ongoing work and most recent results across a broad spectrum of materials science, physics, and applied technologies. The event regularly attracts participants from other Latvian and international research institutions, fostering interdisciplinary dialogue and strengthening scientific networks beyond institutional and national borders.
WHAT THE CONFERENCE OFFERS
The conference promotes the exchange of knowledge and ideas, showcases laboratory achievements, and helps identify new opportunities for scientific cooperation.
It serves as a meeting point for researchers at all career stages – from established scientists to doctoral students and early-career researchers – encouraging open discussion, collaboration, and the development of new research initiatives.
SUPPORTING THE NEXT GENERATION OF SCIENTISTS
A special emphasis is placed on the professional growth of young researchers.
The conference offers a supportive, high-level scientific environment where students and early-career scientists can
present their research
receive constructive feedback from experienced colleagues
strengthen their scientific communication and presentation skills
SCOPE OF THE CONFERENCE
Nanotechnologies
Photonics
Sensors
Optical materials
Organic materials
Materials for energy applications
Micro and nanofabrication
Structure and morphology
Theory and modelling
Thin films and coatings
Nanomaterials
Devices and prototypes
CALL FOR ABSTRACTS
Researchers, students, and partners are invited to submit their abstracts and share their latest research.
Deadline for submission: 13 February 2026
The ISSP annual conference connects fundamental research with applied perspectives, fostering scientific exchange, collaboration, and new ideas.
Join researchers, students, and partners shaping the future of materials science and technologies!