Deep Science Hackathon
We invite you to participate in a development of high-tech in Deep Science Hackathon on February 15-17. We are looking for high-tech ideas based on intelligent materials.
The Deep Science Hackathon will be the second Hackathon in Latvia of that kind. For three days, participants will create interdisciplinary teams and develop ideas with a help of mentors. At the end of the event, they will present their ideas to a jury, investors and stakeholders.
We expect participants with completely fresh ideas as well as those that have reached a prototype stage. We also look forward to welcome participants from companies with existing products that would benefit from further development with the help of advanced technology.
We are looking forward to ideas from the following areas:
- Smart materials
- Sensors and actuators
- Coatings and thin films
- Micro / nano electronics
If you do not have an own idea, you will have the opportunity to join one of the teams with your expertise (physics, materials science, chemistry, business development, design, engineering, programming, marketing, etc.).
All participants will be supported by the international team of mentors. The best ideas will get the opportunity to continue implementing the idea in the ISSP UL support program, as well as valuable awards from supporters.
More about DSH 2018 in Facebook:
17:30 - Check-in, networking, coffee, snacks
18:00 - Opening & Introduction, Start-up Ecosystem
19:30 - Presentation of ideas
21:00 - Team formation
22:00 - Team training – Steps Plan
22:30 - Team works begins
9:00 – Breakfast
10:00 – 1st Checkpoint & Team Training
10:30 – Preparation for Mentor session
11:00 – Presentations for Mentors
12:00 – Lunch
12:30 – Mentors works with every team
16:30 – break
16:45 – 2nd Checkpoint
18:30 – Dinner
19:30 – Key working night
9:00 – Breakfast
10:00 – Energizer & Updates
10:15 – 3rd Checkpoint
11:30 – 1st Pitch training session
13:00 – Lunch
14:00 – 4rd Checkpoint
16:30 – Final updates & reflections
17:00 – Final Event
19:30 – Wrap-up & Networking
Institute of Solid State Physics, University of Latvia (ISSP UL) is organizing and hosting this event. ISSP UL is an internationally recognized leader with 40 years of experience in material science, offering internationally competitive research and innovative solutions for industrial applications.